Pradeep, For what its worth, we routinely ground flood single signal layers that are immediately adjacent to power layers to reduce ground impedance and improve thermal conductivity, but we don't flood signal layers that are paired with other signal layers to avoid impedance discontinuities. Ivor Bowden on 2/23/2006 12:04 AM Pradeep RSA wrote: > Hi, > does a Ground Pour in the Signal layers in a multilayer PCB (with > sufficient internal ground planes) really helps? > > Thanks in advance > Pradeep ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List FAQ wiki page is located at: http://si-list.org/wiki/wiki.pl?Si-List_FAQ List technical documents are available at: http://www.si-list.org List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu