[SI-LIST] Re: Ground Pour in Signal Layers

So the signal integrity aspect:

Either do it yourself so you know where it is.=20

Or --

Place a requirement on the fab drawing that requires approval of the
engineer. This is risky because sometimes the fab vendor will call your
layout department and the answer might not be what you would have said!

There is another perspective as well: thieving can destroy a clearance
and result in losing a safety approval. So it really is best to have
your layout team do it.

Overall it makes sense -- if you don't have to etch that copper away
then process times should decrease, yields should go up and life should
be better :-) None of this is huge, but all of our little efforts add
up!

                                                Curt

Curt McNamara. P.E.=20
Senior Electrical Engineer=20
Logic Product Development=20
411 Washington Ave. N Suite 101=20
Minneapolis, MN 55401=20
Tel 612-436-5178=20
Fax 612-672-0443=20
curtm@xxxxxxxxxxx=20
www.logicpd.com=20
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-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx]
On Behalf Of Robert Sefton
Sent: Tuesday, February 28, 2006 1:02 PM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Re: Ground Pour in Signal Layers


Search the TechNet archives. Thieving comes up quite a bit. I'd say the
consensus is that thieving on inner layers is important to help bonding.
Some also claim it can help reduce warpage. On outer layers it's to
achieve more uniform plating.

http://listserv.ipc.org/archives/technet.html

Bob S.

-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx]
On Behalf Of Lee Ritchey
Sent: Tuesday, February 28, 2006 10:08 AM
To: Charles Grasso; Gerry Gagnon; rhaller@xxxxxxxxxxxxx
Cc: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Re: Ground Pour in Signal Layers

Might want to check with the process engineers at Merix or TTM on this
one.


> [Original Message]
> From: Grasso, Charles <Charles.Grasso@xxxxxxxxxxxx>
> To: <leeritchey@xxxxxxxxxxxxx>; Gerry Gagnon <mrgagman@xxxxxxxxxxx>;
<rhaller@xxxxxxxxxxxxx>
> Cc: <si-list@xxxxxxxxxxxxx>
> Date: 2/28/2006 9:34:58 AM
> Subject: RE: [SI-LIST] Re: Ground Pour in Signal Layers
>
> How interesting! I have not had to deal with thieving on inner layers
> so I popped down to our layout group and asked our folks there. The=20
> consensus was - YES - Thieving on inner layers can be necessary and=20
> should be used for unbalanced layouts. Indeed one former employee of=20
> DDI indicated that DDI had a program that automatically added thieving

> based on the design. The reason for adding the thieving is to avoid=20
> warpage.
>
>
> Best Regards
> Charles Grasso
> Senior Compliance Engineer
> Echostar Communications Corp.
> Tel: 303-706-5467
> Fax: 303-799-6222
> Cell: 303-204-2974
> Pager/Short Message: 3032042974@xxxxxxxx
> Email: charles.grasso@xxxxxxxxxxxx;
> Email Alternate: chasgrasso@xxxxxxxx
>

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