[SI-LIST] Re: GND Separation for Analog & Digital circuits

John,
What do all these MCM papers promoting mesh power distribution to do with
PCB power distribution design ?
There are many reasons why MCM or ultra fine pitch substrates use meshed
power/gnd planes. They vary from degassing requirements on organic substrate
to via and interconnect constrain like IBM TCM. However, they are
fundamentally different to regular PCBs. I have design many MCM and fine
pitch packages and I have never seen a mesh design out perform electrically
over a conventional solid reference planes PCB. The practice came out from
process requirement more than performance enhancement. I don't see why it
should be promoted in places where it is not necessary.


-----Original Message-----
From: John Barnes [mailto:jrbarnes@xxxxxxxxx]
Sent: Wednesday, February 25, 2004 8:29 AM
To: psalmon2000@xxxxxxxxx; si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Re: GND Separation for Analog & Digital circuits


Peter,
You may want to read up on the "Interconnected Mesh Power System
(IMPS)".  I'm still updating my bibliography on Power Distribution on
Printed Circuit Boards (   http://www.dbicorporation.com/pwr-bib.htm  
), but recently ran across the following pertinent papers:

*  Glover, Michael D., and Schaper, Leonard W., "A Functional Module
   Comparison of the Interconnected Mesh Power System (IMPS) with a 
   Standard Four-layer MCM Topology," <CITE>Proceedings 1996 IEEE 
   Multi-Chip Module Conference</CITE>, Santa Cruz, Feb. 6-7, 1996, pp. 
   143-146.

*  Low, Yee L., Schaper, Len W., and Ang, Simon S., "A Low-Cost MCM 
   Design Topology-the Interconnected Mesh Power System (IMPS)," <CITE> 
   Proceedings 1995 Multi-Chip Module Conference</CITE>, Jan.  31-Feb.  
   2, 1995, pp.  200-205.

*  Low, Yee L., Schaper, Leonard W., and Ang, Simon S., "Modeling and
   Experimental Verification of the Interconnected Mesh Power System 
   (IMPS) MCM Topology," <CITE>IEEE Transactions on Components, 
   Packaging, and Manufacturing Technology - Part B</CITE>, vol.  20, 
   no.  1, pp.  42-49, Feb.  1997.

*  Low, Yee L., and Frye, Robert C., "Signal Integrity and Power
   Distribution Systems Analyses for a 4x4 ATM Switch MCM," 
   <CITE>Proceedings of the 1997 International Conference on Multichip 
   Modules</CITE>, Denver, CO, Apr.  2-4, 1997, pp.  278-283.

*  Low, Y.  L., Schaper, L.  W., Ang, S., and Oldham, D., "The
   Interconnected Mesh Power System (IMPS) MCM Topology," 
   <CITE>Proceedings of IEEE 3rd Topical Meeting on Electrical 
   Performance of Electronic Packaging </CITE>, Monterey, CA, Nov.  2-4, 
   1994, pp.  231-234.

*  Parkerson, James Patrick, and Schaper, Leonard W., "Advanced
   Interconnected Mesh Power System (IMPS) MCM Topologies," 
   <CITE>Proceedings 1996 IEEE Multi-Chip Module Conference</CITE>, 
   Santa Cruz, CA, Feb.  6-7, 1996, pp.  123-126.

*  Schaper, L.  W., Ang, S., and Low, Y.  L., "Design of the
   Interconnected Mesh Power System (IMPS) MCM Topology," 
   <CITE>Proceedings of the 1994 International Conference on Multichip 
   Modules</CITE>, Denver, CO, April 13-15, 1994, pp.  543-548.

*  Schaper, L.  W., Ang, S., Low, Yee L., and Oldham, Danny R.,
   "Electrical Characterization of the Interconnected Mesh Power System 
   (IMPS) MCM Topology," <CITE>IEEE Transactions on Components, Hybrids, 
   and Manufacturing Tech - Part B</CITE>, vol.  18, no.  1, pp.  
   99-105, Feb.  1995.

*  Schaper, L.  W., Ang, S., Low, Y.  L., and Oldham, D., "Electrical
   Characterization of the Interconnected Mesh Power System (IMPS) MCM 
   Topology," <CITE>1994 Proceedings 44th Electronic Components & 
   Technology Conference</CITE>, Washington, D.C., May 1-4, 1994, pp.  
   791-795.

Gridding power and ground is a standard layout technique for
double-sided printed circuit boards.  I discuss it in chapter 31,
"Designing Printed Circuit Boards", (specifically on pages 31-67 through
31-69) of my upcoming    Robust Electronic Design Reference Book,
Volumes 1 and 2.  Kluwer Academic Publishers expects to have my book in
print in late March (   
http://www.wkap.nl/prod/b/1-4020-7739-4,  
http://www.wkap.nl/prod/b/1-4020-7739-4?a=2, 
http://www.dbicorporation.com/book-out.htm,  
http://www.dbicorporation.com/errata.htm   ).

                John Barnes KS4GL, PE, NCE, ESDC Eng, SM IEEE
                dBi Corporation
                http://www.dbicorporation.com/
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