[SI-LIST] Fwd: Re: About the chassis gnd and logic gnd
- From: steve weir <weirsp@xxxxxxxxxx>
- To: <si-list@xxxxxxxxxxxxx>
- Date: Thu, 25 Mar 2004 09:37:23 -0800
>Date: Thu, 25 Mar 2004 07:52:24 -0800
>To: peter.zhu@xxxxxxxxxx, <si-list@xxxxxxxxxxxxx>
>From: steve weir <weirsp@xxxxxxxxxx>
>Subject: Re: [SI-LIST] About the chassis gnd and logic gnd
>
>Peter, the subject has been covered many times. There are seemingly
>religious views on this.
>
>I belong to the "reduce antenna gain" camp, which is to say that at high
>frequencies, even an air gap does not effect isolation, it just increases
>antenna gain and ESD susceptibility. So multipoint bonding is the
>preferred strategy in my book. Bond often, and bond well. There is one
>caveat, and that is if you have external low voltage power supplies, then
>you have to watch the return current path. But since you likely use
>isolated DC-DC converters, this should not present an issue to you.
>
>This point of view is supported by practices at major successful
>manufacturers such as Cisco where those practices resulted in behemoth
>boxes like the 12000 that have no EMC issues at all. It is also supported
>by respected authors like Mark Montrose, and Doug Smith who show the
>science behind why this practice works, as well as successful engineers
>with many years experience like Chris Cheng. My recollection is that John
>Barnes covers this subject in his books as well. If you can afford them,
>and even if you can't, John brings many years experience including with
>ultra cost sensitive consumer product.
>
>If you go to Doug Smith's web site, www.emcesd.com and look up his April
>2002, May 2002, and October 2002 "Technical Tidbits" he demonstrates the
>value of multipoint grounding very clearly for ESD immunity.
>
>Regards,
>
>
>Steve.
>At 07:43 PM 3/25/2004 +0800, peter zhu wrote:
>>all:
>>About the chassis GND and the logic GND, some company tie them together, and
>>some sompanies separate them.
>>In telecom equipments, I see many companies, such as NOKIA, tie them
>>together, and the backplane only has uniform GND layer for chassis gnd and
>>logic gnd. We separate them in our backplane, but it will result in PCB gnd
>>layer partition. So form the PCB view, we hope the uniform gnd.
>>What's the recommendation form the EMC/EMI view? and what's your company's
>>strategy?
>>
>>Thank,
>>
>>Peter
>>UTStarcom
>>
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>
>Steve Weir
>Teraspeed Consulting Group LLC
>2926 SE Yamhill St.
>Portland, OR 97214
>(503) 239-5536
>http://www.teraspeed.com
>------------------------------------------------------------------------------------------------------
>Teraspeed(SM) is the service mark of Teraspeed Consulting Group LLC
Steve Weir
Teraspeed Consulting Group LLC
2926 SE Yamhill St.
Portland, OR 97214
(503) 239-5536
http://www.teraspeed.com
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Teraspeed(SM) is the service mark of Teraspeed Consulting Group LLC
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