[SI-LIST] Re: Flooded Vias vs Thermal Relief

  • From: steve weir <weirsi@xxxxxxxxxx>
  • To: Jack Olson <pcbjack@xxxxxxxxx>
  • Date: Fri, 19 Mar 2010 07:14:16 -0700

Jack, I would demand that anyone promoting such an idea back it up with 
real numbers.  The back of my envelope shows that for reasonable thermal 
ties the difference between solid and tied is about 24pH for a via pair, 
or the equivalent of less than 2mils Z axis.

Steve.

Jack Olson wrote:
> Greetings,
> I am being instructed to flood all vias instead of using thermal relief, to
> get a "better" connection to planes. I've typically used thermal reliefs
> simply because they are easier to see in checking or design reviews (but its
> only one mouse click for me to change them so I'm not really complaining).
>
> but it got me thinking.....
>
> Have any test results ever showed that spokes have a significant impedance
> or anything that can change circuit performance?
> (and I'm referring to 12mil plated through-hole vias on boards 100MHz max)
>
> I don't remember anyone ever talking about that.
>
> surfin' the learnin' curve,
> Jack
>
>
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-- 
Steve Weir
IPBLOX, LLC 
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