[SI-LIST] FREE SEMINAR: Tuesday 3/27/07 Noon-2PM (Santa Clara)

                               Presented by Happy Holden / Mentor Graphics    
HDI ROUTING HIGHLIGHTS AND INSIGHTS 
  Tuesday, March 27; 12:00 PM to 2:00 PM (FREE) 
  Room 210
  Santa Clara Convention Center
  PCB Design Conference West 2007
  Santa Clara, CA
   
  DESCRIPTION:  This is a short overview and introduction to an advanced PCB 
technology, High Density Interconnects (HDI) or as it is called, Microvia or 
Build-Up Technology. Two growing product focuses, miniaturization and ball grid 
arrays, have come into common use, and created the need for advanced printed 
wiring boards (PWB) - - both as the board and as the package. This short 
discussion looks at basic technologies for HDI routing of portable products, 
high performance computing, telecom and dense System-In-Package (SiP) modules. 
PWB wiring stackups, design rules, and selection of PWB microvia structures 
will be examined and compared. The program will define how to select circuit 
routing guidelines, manufacturing process features to permit the use of widely 
accepted fine pitch and high I/O BGA components. Participants are encouraged to 
bring along their technical questions for discussion.
   
  Who Should Attend: Project Managers, design and hardware engineers, field 
support personnel, pcb layout, design, process, failure analysis, and 
reliability engineers, others.
   
  Topics: AGENDA for  Seminar 12:00 pm 
  What is microvia technology and how long has it been around?
  When should we use ìvias?:  Density, Reliability, Weight/Size. Electrical 
Performance
  Examples of through-hole boards converted to ìvia designs.
  Implementation, design rules and IPC Standards. 
  Channel and Boulevard Trace Routing for BGAs?
  Which constructions are possible?
  High I/O and Fine-pitch BGA routing with ìvias. 
  Layer Reduction Strategies   
   
  INSTRUCTOR: Happy Holden, Mentor Graphics-SDD Longmont, CO 
  Happy Holden is Senior PCB Technologist for Advanced Technologies for Mentor 
Graphics. He is responsible for customer consulting and roadmaps for next 
generation Printed Circuit Manufacturing Technologies, advanced design tools 
and design consulting. Prior to joining Mentor, he was a consultant with 
Westwood/NanYa PCB, TechLead Corporation and Merix, and had retired from 
Hewlett-Packard after over 30 years. Mr. Holden formerly managed 
Hewlett-Packard's application organizations in Taiwan and Hong Kong and printed 
circuits R+D. He is a frequent speaker on Printed Circuit Topics and Packaging 
Strategies and has had over 90 technical papers published on automation, 
printed circuits, advanced packaging, DFM and process engineering and chapter 
in three PCB Books. He is a member of IEEE, IPC, SMTA, and IMAPS. 
   
  ~  ~  ~  ~  ~  ~
   
  This seminar is FREE!
   
  BRING YOUR OWN LUNCH, LEARN WHILE YOU MUNCH
   
  Reserve your seat today, send e-mail to SV_IPC@xxxxxxxxx
  
http://dcchapters.ipc.org/svc/
   
   
  ~  ~  ~  ~  ~  ~
   


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