[SI-LIST] EMI and Power plane card edge clearance distance

I remember reading something (article, e-mail) about the EMI benefits of
etching  back power/ground sandwich planes at different levels. (i.e. power
plane back 50 mils from the card edge and the ground plane back 100 mils).
Anybody know anything about this or have a comment one way or another?

Stacy L. Gore
Hardware Engineering Staff
Raytheon - Garland Site
Phone - (972) 205-4208
Fax - (972) 205-8083

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