[SI-LIST] Re: Dielctric loss microstip/stripline
- From: <Christopher.Jakubiec@xxxxxxxxxxxx>
- To: <babid_a@xxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
- Date: Mon, 19 Dec 2005 13:04:08 -0800
Babid,
I believe that the dielectric loss is related to the heating effect of
the dielectric material between conductors. Now consider how this would
be different between microstrip and stripline, which one would dissipate
more heat??
-Chris Jakubiec
Infineon Technologies=20
-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx]
On Behalf Of Babid A
Sent: Monday, December 19, 2005 2:35 PM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Dielctric loss microstip/stripline=20
Why is the dielectric loss lower in microstrip compared to stripline?
=20
-Thanks
Ray Anderson <ray.anderson@xxxxxxxxxx> wrote:
Forwarded to the list for Bob (rhaller@xxxxxxxxxxxxx)
-----Original Message-----
From: Haller, Robert [mailto:rhaller@xxxxxxxxxxxxx]=3D20
Sent: Monday, December 19, 2005 6:31 AM
To: ray.anderson
Subject: [SI-LIST] Re: Microstrip/Stripline
Ray Can you please post this to Si-list (until such time as we resolve
my posting issues)
----------------------------------------
This Micro-strip Strip-line thread is an interesting discussion that I
have previously pursued off-line with a few colleagues/list members. I
would love to see hard bench data that is a true apple to apples
comparison in time and frequency domains. =3D20
I have past experience in board shops and typical Micro-strip processes
do exhibit higher variations and until recently always preferred
stripline environments. But recent 2D/3D simulations have led me to
believe that Micro-strip can be designed to produce 'longer' working
links. =3D20
A number of folks I have discussed this issue with agree that=3D20
Microstrip usually has Higher crosstalk=3D20 More difficult to control
Z0=3D20 Lower dielectric losses (not including Solder mask) Can avoid =
via
stubs =3D20 Stripline usually has Lower crosstalk Homogenous environment
(except for glass weave) Higher dielectric losses Via stubs
But what happens when you are routing high-speed differential networks
(Module and/or Backplanes) and you want to accurately compare theses 2
unique environments with similar routing densities.
Equivalent line widths/lengths between stripline and microstrip,
Microstrip with LPISM (Solder mask) and no via stubs, Microstrip
conductor shape not as well controlled.
Dual stripling - Single reference plane (second plane far away),
Stripline with Via stubs.
Regards, Bob
Robert Haller
Enterasys Networks
Core Routing - Hardware
Phone: 978-684-1340=3D20
FAX: 978-684-1499
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