[SI-LIST] Decoupling capacitor placement

Hello,
I am looking to add more decoupling to a high pin count BGA and due to 
routing 
constraints I am unable to get as close as I would like to the device. 
Does anyone
have any experience with making one land pad and then soldering a couple 
caps
on top of each other to the one land area?  Say something like a 0603 
.01uf on top of
another 0603 .001uf.  I see this as an easy way to get close to the device 
as well as reduce
lead and via inductance.  Have I missed something electrically fundamental 
or are 
there production level assembly issues with this method?

Thanks,
Chris

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