[SI-LIST] Re: Current capacity of a Solder Ball
- From: Brian Schieck <BSchieck@xxxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Wed, 5 Feb 2003 17:03:39 -0800
All I want is the current capacity.
Consider power delivery
Balls > Plane > Wires or Bumps
If my IC needs 20 Amps DC for core support how many bumps are needed to
supply this? I know the capacity of the ball pads on the bottom
(cu thickness / width / size ). I know a blind via (filled can carry 400 ma)
and I can use multiple vias / ball pad/.
I know the planes can handle more than 20 AMPS. I know if
it is Wirebond each 0.9 mil wire can handle 900 ma. So how much can a ball
carry underrated? I'll figure out what I would like to apply as a derating
i.e. the addition of balls till I'm comfortable with the power delivery.
I want to design quantity of Balls to a real spec. I want to decide my
margin.
I know that 400 ma is bull. Balls can pull AMPS.
Brian Schieck
NVidia Corporation
2701 San Tomas Expressway MS B22-221
Santa Clara, California 95050
Direct Phone # (408) 486-2697
Corp Phone # (408) 486-2000 x62697
Local Fax # (408) 486-8078
Corp Fax # (408) 486-2200
Email bschieck@xxxxxxxxxx
-----Original Message-----
From: James.Freeman@xxxxxxxxxxxx [mailto:James.Freeman@xxxxxxxxxxxx]
Sent: Wednesday, February 05, 2003 4:30 PM
To: Brian Schieck
Subject: RE: [SI-LIST] Current capacity of a Solder Ball
Hi Brian,
How are things. Are you looking at a bump or a ball for this info?
Jim Freeman
-----Original Message-----
From: Brian Schieck [mailto:BSchieck@xxxxxxxxxx]
Sent: Wednesday, February 05, 2003 11:13 AM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Current capacity of a Solder Ball
Does any one know what the current carrying capacity of a solder ball is?
How is the capacity determined? Is the capacity derated to account for
temperature and voids?
for a 60 mil solder ball.
Brian Schieck
NVidia Corporation
2701 San Tomas Expressway MS B22-221
Santa Clara, California 95050
Direct Phone # (408) 486-2697
Corp Phone # (408) 486-2000 x62697
Local Fax # (408) 486-8078
Corp Fax # (408) 486-2200
Email bschieck@xxxxxxxxxx
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