[SI-LIST] Re: Cu Thickness
- From: 김흥규 <khk264@xxxxxxxxx>
- To: <sunil_bharadwaz@xxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
- Date: Wed, 18 Jul 2007 23:45:56 +0900
You need to prohibit noise propagation from digital to RF part.
Cu thickness is not big thing, but the distance and power distribution
plane
Shape is more serious.
I think you had better consider using stitch capacitor between power plane.
Good luck
HKKim
-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] On
Behalf Of sunil bharadwaz
Sent: Monday, July 16, 2007 12:49 AM
To: SI LIST
Subject: [SI-LIST] Cu Thickness
Hi Experts ,
I have been doing mixed signal boards , Digital , Analog & RF .RF up to
5 Ghz.No big issues so far.
We are planning to do similar kind of boards with a new SOC.There is
a concern regarding the IR drop as most of the permissible margins are
eaten away at the package & chip levels.
To mitigate this effect to a larger extent , the plan is to use 2 Ounce &
higher levels of Cu thickness.So far we have been doing the mixed signal
boards with Cu thickness of 1 Oz.
Could there be any issues with this approach for the mixed signal boards ?
Appreciate any inputs in this regards.
Best Regards
Sunil.B
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- References:
- [SI-LIST] Cu Thickness
- From: sunil bharadwaz
Other related posts:
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- » [SI-LIST] Re: Cu Thickness
- » [SI-LIST] Re: Cu Thickness
- » [SI-LIST] Re: Cu Thickness
- » [SI-LIST] Re: Cu Thickness
- » [SI-LIST] Re: Cu Thickness
- » [SI-LIST] Re: Cu Thickness
- [SI-LIST] Cu Thickness
- From: sunil bharadwaz