[SI-LIST] Re: Cu Thickness
- From: olaney@xxxxxxxx
- To: sunil_bharadwaz@xxxxxxxxx
- Date: Sun, 15 Jul 2007 12:00:28 -0700
There shouldn't be any electrical issues but there are a few thermal
details. Basically, you will have to make sure you have adequate thermal
reliefs at plane connections, because with twice the copper thickness any
given size relief will heat sink twice as well. This becomes a
solderability and rework issue. I presume the extra thickness is just
for the internal power and ground planes. It wouldn't help to use it in
a signal layer.
Orin Laney
Have you calculated the
On Sun, 15 Jul 2007 08:48:50 -0700 (PDT) sunil bharadwaz
<sunil_bharadwaz@xxxxxxxxx> writes:
> Hi Experts ,
> I have been doing mixed signal boards , Digital , Analog & RF .RF up
> to
> 5 Ghz.No big issues so far.
>
> We are planning to do similar kind of boards with a new SOC.There is
>
> a concern regarding the IR drop as most of the permissible margins
> are
> eaten away at the package & chip levels.
>
> To mitigate this effect to a larger extent , the plan is to use 2
> Ounce &
> higher levels of Cu thickness.So far we have been doing the mixed
> signal
> boards with Cu thickness of 1 Oz.
>
> Could there be any issues with this approach for the mixed signal
> boards ?
>
> Appreciate any inputs in this regards.
>
> Best Regards
> Sunil.B
>
>
>
>
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