Hi Experts , I have been doing mixed signal boards , Digital , Analog & RF .RF up to 5 Ghz.No big issues so far. We are planning to do similar kind of boards with a new SOC.There is a concern regarding the IR drop as most of the permissible margins are eaten away at the package & chip levels. To mitigate this effect to a larger extent , the plan is to use 2 Ounce & higher levels of Cu thickness.So far we have been doing the mixed signal boards with Cu thickness of 1 Oz. Could there be any issues with this approach for the mixed signal boards ? Appreciate any inputs in this regards. Best Regards Sunil.B --------------------------------- The fish are biting. Get more visitors on your site using Yahoo! Search Marketing. ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.net List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu