[SI-LIST] Re: Bypass vs Decoupling capacitors
- From: Zhangkun <zhang_kun@xxxxxxxxxx>
- To: steve weir <weirsp@xxxxxxxxxx>, istvan.novak@xxxxxxxxxxxxxxxx
- Date: Fri, 27 Aug 2004 21:25:50 +0800
Steve
If the thickness of dielectric is about 4mil, the impedance of plane pair could
be about 5-10 ohm. With good fanout tech, the inductance could be controlled
below 0.5nH. By the way, carefully selecting decoupling capacitor is also
helpful.
Best Regards
Zhangkun
2004.8.27
----- Original Message -----
From: "steve weir" <weirsp@xxxxxxxxxx>
To: "Zhangkun" <zhang_kun@xxxxxxxxxx>; <istvan.novak@xxxxxxxxxxxxxxxx>
Cc: <si-list@xxxxxxxxxxxxx>
Sent: Friday, August 27, 2004 9:10 PM
Subject: Re: [SI-LIST] Re: Bypass vs Decoupling capacitors
> Zhangkun, are you talking about trace inductance as in:
>
> VRM => trace => decoupling => trace => loads
>
> OR
>
> VRM => trace => planar island w/ decoupling?
>
> I am talking about the second case. The first case has high impedance.
>
> Power plane SRF is a function of geometry and Er. The issue is what is the
> relative cost and headaches to damp the planes making them into
> transmission lines, versus chopping them up.
>
> 100 ohms sounds quite high. We would be thinking in the low ohms or 100's
> of mohms. The difficult part is the attachment inductance. If I have a
> perfect resistor at 500mohms, but have to attach through 1nH of inductance,
> then at 1GHz, the inductive reactance is more than 12 times the resistance
> and the phase will be about 85 degrees. Even using an IDC type structure
> we are not going to get close to the order of magnitude improvement needed.
>
> Now, the one thing that I have not given too much thought to is whether we
> can get away with inductive terminations if we remain resistive through the
> first few harmonics of the board SRF.
>
> Regards,
>
>
> Steve.
> At 06:25 PM 8/27/2004 +0800, Zhangkun wrote:
> >istvan and steve
> >
> >I want to add some comments on this topic.
> >
> >1.The power delivery system, which uses traces not plane, will have some
> >defect for the leading inductance. We have done a lot of simulation about
> >the leading inductance of decoupling capacitor. When the trace is taken
> >placed by plane, the ESL gets less of about 6db.
> >
> >2.The resonance about power plane could be eliminated by means of some
> >effort. The frequency could be extended to about 1GHz or higher. However,
> >in some product PCB, there is no space for this kind of measures. The PCB
> >is too crowded. AVX has provided some high-ESR capacitor, whose ESR could
> >be as large as 100 ohm.
> >
> >3.Using trace for power delivery could be used for some special circuit
> >such as PLL. There are some paper in IEEE International Symposium on EMC
> >2003 on this topic.
> >
> >Best Regards
> >
> >Zhangkun
> >2004.8.27
>
>
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- [SI-LIST] Re: Bypass vs Decoupling capacitors
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