[SI-LIST] Re: BGA Vs QFP

Canes

MS-034b.pdf BGA Body size 17x17mm
MS-029A.pdf QFP Body size 28x28mm

-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx]
On Behalf Of Canes Venatici
Sent: Monday, April 23, 2007 6:40 AM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] BGA Vs QFP

Hi all,
I'm having some confusion related to BGA. I believe BGA can have planes
for ground, core vdd, io vdd etc.
Since the planes are equipotential, can I assume for same number of
power pin count in QFP, I can reduce balls in BGA.
For ex.,=20
I have a common die for two packages say, QFP and BGA with same number
of pads for both packages.=20
But I want to reduce the power pin count by taking advantage of planes
in BGA. Is it possible?

Could anyone throw some light on it?

Regards
Canes




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