[SI-LIST] BGA Vs QFP

Hi all,
I'm having some confusion related to BGA. I believe BGA can have planes for 
ground, core vdd, io vdd etc.
Since the planes are equipotential, can I assume for same number of power pin 
count in QFP, I can reduce balls in BGA.
For ex., 
I have a common die for two packages say, QFP and BGA with same number of pads 
for both packages. 
But I want to reduce the power pin count by taking advantage of planes in BGA. 
Is it possible?

Could anyone throw some light on it?

Regards
Canes




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