[SI-LIST] Airbox sensitivity for gap source port

Hi,

I tried to model a LCC (leadless chip carrier) package with wirebonds from 
IO pads to die paddle. I assigned gap sources to both i)IO pads interface to 
PCB, and ii)between end of wirebonds and die paddle. Since the simulation 
was really a long one, i did not have a chance to check its different 
sensitivity to its airbox size 'encapsulating' the LCC package. I assigned 
the airbox as radiation boundary. If i were to use wave ports (but in my 
case, all ports were internal), then i know i shd scale the airbox at least 
to allow the port has H=10h and W=5w.
My question is to know if anyone can share his/her opinions on this or may 
be propose a better way to perform package modeling.

Thanks.
gh

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