[SI-LIST] Airbox sensitivity for gap source port

Hi,

I tried to model a LCC (leadless chip carrier) package with
wirebonds from IO pads to die paddle. I assigned gap sources to both
i)IO pads interface to PCB, and ii)between end of wirebonds and die
paddle. Since the simulation was really a long one, i did not have a
chance to check its different sensitivity to its airbox size
'encapsulating' the LCC package. I assigned the airbox as radiation
boundary. If i were to use wave ports (but in my case, all ports
were internal), then i know i shd scale the airbox at least to allow
the port has H=10h and W=5w.
My question is to know if anyone can share his/her opinions on this
or may be propose a better way to perform package modeling.

Thanks.
gh

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