[SI-LIST] About the chassis gnd and logic gnd

all:
About the chassis GND and the logic GND, some company tie them together, and
some sompanies separate them.
In telecom equipments, I see many companies, such as NOKIA, tie them
together, and the backplane only has uniform GND layer for chassis gnd and
logic gnd. We separate them in our backplane, but it will result in PCB gnd
layer partition. So form the PCB view, we hope the uniform gnd.
What's the recommendation form the EMC/EMI view? and what's your company's
strategy?

Thank,

Peter
UTStarcom

------------------------------------------------------------------
To unsubscribe from si-list:
si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field

or to administer your membership from a web page, go to:
http://www.freelists.org/webpage/si-list

For help:
si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field

List FAQ wiki page is located at:
                http://si-list.org/wiki/wiki.pl

List technical documents are available at:
                http://www.si-list.org

List archives are viewable at:     
                http://www.freelists.org/archives/si-list
or at our remote archives:
                http://groups.yahoo.com/group/si-list/messages
Old (prior to June 6, 2001) list archives are viewable at:
                http://www.qsl.net/wb6tpu

Other related posts: