[SI-LIST] AW: Use of Tenting Phenomena during Solder Masking
- From: "Thomas Beneken" <beneken@xxxxxxxxxxxx>
- To: <AdeelM@xxxxxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
- Date: Tue, 8 Jan 2002 16:22:34 +0100
Hole "capping/tenting" is available through the via cap process. On board=
s
coated with liquid photo-imageable mask, the vias can be screened with an
epoxy or acrylic soldermask material creating a cap over the hole.
Override is setting the solder mask expansion for a specific pad thus
overriding the default.
Regards, Thomas Beneken
-----Urspr=FCngliche Nachricht-----
Von: si-list-bounce@xxxxxxxxxxxxx
[mailto:si-list-bounce@xxxxxxxxxxxxx]Im Auftrag von Adeel Malik
Gesendet: Dienstag, 8. Januar 2002 14:10
An: si-list@xxxxxxxxxxxxx
Betreff: [SI-LIST] Use of Tenting Phenomena during Solder Masking
While routing the boards many PCB design softwares define various propert=
ies
of the PADS which are required by the Fabricators. One of the property is
whether designer wants a Solder Mask feature for a particular pad with a
'Tenting' or 'Override' option during PCB fabrication. Can someone tell m=
e
whats meant by tenting or override in this regard.
Thanks,
Adeel Malik,
SI engineer,
Islamabad, Pakistan.
Tel: 92-051-2826160
Fax: 92-051-2827469
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