[SI-LIST] Re: AW: Multi-Giga-Hertz Rigid-Flex Feasibility
- From: Hirshtal Itzhak <ihirshtal@xxxxxxxxxx>
- To: "Havermann, Gert" <Gert.Havermann@xxxxxxxxxxx>, si-list@xxxxxxxxxxxxx
- Date: Sun, 29 Nov 2009 09:59:07 +0200
Hello Gert
First - thank you for your contribution.
I have a few questions regarding your email:
1) You refer to a trace width of 0.8mm as "small". This is a 31.5mil width,
which I hardly call "small"! I regularly use 3-4 mil trace widths in my
designs. Is there something different in Flex circuits, which enforces me to
use such LARGE traces (compared to my regular traces)?
2) I see the problem you mention for the Microstrip configuration. Is it common
to use Stripline on a flex circuit? I was told this is impractical, although
I'm not sure what the reason is.
Thanks
Itzhak Hirshtal
Elta
-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] On
Behalf Of Havermann, Gert
Sent: Tuesday, November 24, 2009 4:19 PM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] AW: Multi-Giga-Hertz Rigid-Flex Feasibility
Hello Itzhak ,
All Polimide (Kapton) materials will do the job from a loss and dispersion
prospective. The tolerance you mention seems to be unreasonable high for an
etching tolerance. I did Flex designs with impedance control, 100Ohm +/-10Ohm,
0.8mm tracewidth without problems (of corse I had to pay extra for the small
trace width).
If you refer to an impedance tolerance due to bending and surrounding material,
thats another story. If you design it in microstrip (as you are planning it),
then everithing touching the flex might change your impedance. Designing it in
stripline decreases the flexibility of the flex and increases cost.
Look for Dupont, Grace Electron or Shengyi Flex materials for more info.
BR
Gert
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-----Ursprüngliche Nachricht-----
Von: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] Im
Auftrag von Hirshtal Itzhak
Gesendet: Dienstag, 24. November 2009 14:21
An: si-list@xxxxxxxxxxxxx
Betreff: [SI-LIST] Multi-Giga-Hertz Rigid-Flex Feasibility
Hello All
My project manager intends to use a rigid-flex design in our next high-speed
board.
He wants to route a few pairs of 3.125GHz from a rigid section to another one
through a flex section.
Does anyone know if this is feasible? I found out that the 2 sections, although
spec'd to be 100-Ohm diff impedance, can still differ substantially - as much
as 30%, because the tolerance of the flex section is +/-20%. Can such a design
work for a substantial trace length? Should I restrict the trace length on the
flex section to be no more than an inch or so, in order to reduce the impact of
the supposed non-uniform impedance?
I intend to use a 2-layer flexible laminate with the pairs on one layer and a
Ground reference on the other one.
Any advice on this matter would be helpful
Thanks
Itzhak hirshtal
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