[SI-LIST] AW: Multi-Giga-Hertz Rigid-Flex Feasibility

Hello Itzhak ,

All Polimide (Kapton) materials will do the job from a loss and dispersion 
prospective. The tolerance you mention seems to be unreasonable high for an 
etching tolerance. I did Flex designs with impedance control, 100Ohm +/-10Ohm, 
0.8mm tracewidth without problems (of corse I had to pay extra for the small 
trace width). 
If you refer to an impedance tolerance due to bending and surrounding material, 
thats another story. If you design it in microstrip (as you are planning it), 
then  everithing touching the flex might change your impedance. Designing it in 
stripline decreases the flexibility of the flex and increases cost.

Look for Dupont, Grace Electron or Shengyi Flex materials for more info.

BR
Gert


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-----Ursprüngliche Nachricht-----

Von: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] Im 
Auftrag von Hirshtal Itzhak
Gesendet: Dienstag, 24. November 2009 14:21
An: si-list@xxxxxxxxxxxxx
Betreff: [SI-LIST] Multi-Giga-Hertz Rigid-Flex Feasibility

Hello All
 

My project manager intends to use a rigid-flex design in our next high-speed 
board.

 

He wants to route a few pairs of 3.125GHz from a rigid section to another one 
through a flex section.

 

Does anyone know if this is feasible? I found out that the 2 sections, although 
spec'd to be 100-Ohm diff impedance, can still differ substantially - as much 
as 30%, because the tolerance of the flex section is +/-20%. Can such a design 
work for a substantial trace length? Should I restrict the trace length on the 
flex section to be no more than an inch or so, in order to reduce the impact of 
the supposed non-uniform impedance?

 

I intend to use a 2-layer flexible laminate with the pairs on one layer and a 
Ground reference on the other one.

 

Any advice on this matter would be helpful

 

Thanks

 

Itzhak hirshtal

 



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