[SI-LIST] Re: 90 degree bend
- From: Jean Audet <jaudet@xxxxxxxxxx>
- To: leeritchey@xxxxxxxxxxxxx, si-list@xxxxxxxxxxxxx
- Date: Tue, 31 Aug 2004 13:39:47 -0400
Any subt. or add. plating processes for fine line fine pitch... like
Buildup technology. So what I'm saying is for those fine line (20um
wide), there are more sensitive from a manufacturing point of view and the
dimension of the corner may be affected (neck) and consequently reduce the
substrate yield... But reduce the yield does not mean it can not be
done....
Jean Audet
Electrical Analysis
World Wide Packaging & Test
IBM Burlington
Tel: 802-769-0835, tie line: 446-0835
Tel: 450-534-6317, tie line: 552-6317
E-mail: jaudet@xxxxxxxxxx
"Lee Ritchey"
<leeritchey@earth To: Jean
Audet/Bromont/IBM@IBMCA, si-list@xxxxxxxxxxxxx
link.net> cc:
Subject: Re: [SI-LIST] Re: 90
degree bend
08/31/2004 12:48
PM
Please respond to
leeritchey
What kind of manufacturing process necks traces down going into corners?
Lee W. Ritchey
Speeding Edge
P. O. Box 2194
Glen Ellen, CA 95442
Phone- 707-568-3983
FAX- 707-568-3504
> [Original Message]
> From: Jean Audet <jaudet@xxxxxxxxxx>
> To: <leeritchey@xxxxxxxxxxxxx>; <si-list@xxxxxxxxxxxxx>
> Date: 8/30/2004 10:19:33 AM
> Subject: Re: [SI-LIST] Re: 90 degree bend
>
>
>
>
>
> OOPS.... you are rigth for PCB traces where the lines are wide.. the
> over-etching should not be a problem..... BUT From a module perspective,
> where the line width can be at 20um wide, the a 90 degree bend may reduce
> the substrate yield because you may neck down the line width into the
> corner and consequently does not meet the design spec. Also from a
> reliability point of view, this neck down will be a weak point.
>
>
>
>
>
> Jean Audet
> Electrical Analysis
> World Wide Packaging & Test
> IBM Burlington
> Tel: 802-769-0835, tie line: 446-0835
> Tel: 450-534-6317, tie line: 552-6317
> E-mail: jaudet@xxxxxxxxxx
>
>
>
>
> "Lee Ritchey"
> <leeritchey@earth To: "Andrew
Ingraham" <a.ingraham@xxxxxxxx>, si-list@xxxxxxxxxxxxx
> link.net> cc:
> Sent by: Subject: [SI-LIST] Re: 90
degree bend
> si-list-bounce@fr
> eelists.org
>
>
> 08/30/2004 12:40
> PM
> Please respond to
> leeritchey
>
>
>
>
>
> This is another of those statements that are not true and should not be
> repeated. Where did this one start?
>
> I use right angle bends in every signal, or rather, I allow them, even
2.4
> GB/S.
>
> How long will it take to get the misinformation purged from our
profession?
>
> Lee W. Ritchey
> Speeding Edge
> P. O. Box 2194
> Glen Ellen, CA 95442
> Phone- 707-568-3983
> FAX- 707-568-3504
>
> I just used the energy it took to be angry to write some blues.
> Count Basie
>
>
> > [Original Message]
> > From: Andrew Ingraham <a.ingraham@xxxxxxxx>
> > To: <si-list@xxxxxxxxxxxxx>
> > Date: 8/30/2004 9:13:51 AM
> > Subject: [SI-LIST] Re: 90 degree bend
> >
> > The other problem is that right-angle bends tend to concentrate etchant
> and
> > may result in over-etching the trace a bit in the corner. Presumably
it
> can
> > lead to a break in the trace.
> >
> > For most of us, that's the reason why we don't use right-angle corners.
> The
> > electrical effects become noticeable if you're doing multi-GHz boards.
> >
> > Regards,
> > Andy
> >
> >
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