[SI-LIST] Re: 4 Layer Stackups
- From: "Doug Hopperstad" <doug.hopperstad@xxxxxxxxxx>
- To: <domenic.torchia@xxxxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
- Date: Thu, 24 Jun 2004 18:23:01 -0500
Nic,
The second stackup would need the routing to be vertical and horizontal =
to control the tandem crosstalk. You did not mention the board thickness =
or trace impedance for the design. In order to achieve power/ground =
interplane capacitance, the spacing between the two planes would need to =
be small.
Outer layer routing will increase the EMI effects but the crosstalk can =
be minimized by controlling the spacing to the reference plane. Remember =
that decoupling capacitors will be needed when layer jumping from non =
adjacent layers. The first stackup is very common and can be found in =
Howard Johnson's "Black magic" book. =20
Doug Hopperstad.
-----Original Message-----
From: Nic Torchia [mailto:domenic.torchia@xxxxxxxxxxx]
Sent: Thursday, June 24, 2004 3:47 PM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] 4 Layer Stackups
Greetings All,
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Can anyone shed some light on what would be considered a "good" 4 layer
stackup? Does anyone have suggestions for reference material I could
read?
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These are the 2 versions we are currently considering. Does anyone know
of any pros/cons for these stackups?
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Sig1/PWR
GND
PWR
Sig2/GND
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or
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GND
Sig1/PWR
Sig2/PWR
GND
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Finally, for a design under 15MHz what is more important: inter-plane
capacitance (pwr/gnd distance minimized) or signal/plane distance to be
minimized?
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Thanks,
Nic Torchia
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Domenic (Nic) Torchia
Product Engineering Manager
NORSCAN
Phone (204) 233-9138 ext.40
Fax (204) 233-9188=20
www.norscan.com
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Our Mission:
"To develop and provide open interface solutions that manage
and secure the physical layer of communication networks"
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