[SI-LIST] 2012 EPEPS Conference - CALL FOR PAPERS

  • From: "MacGregor, Kara Lynn" <kmacgreg@xxxxxxxxxxxx>
  • To: "si-list@xxxxxxxxxxxxx" <si-list@xxxxxxxxxxxxx>
  • Date: Tue, 10 Apr 2012 19:47:04 +0000

Dear Members,
The call for papers for the 21st Conference on Electrical Performance of 
Electronic Packaging and Systems is posted at our website 
http://epeps.org<http://epeps.org/> and can be accessed through the link "call 
for papers<http://epeps.ece.illinois.edu/papers.html>" .  The conference is 
held during Oct. 21-24, 2012, in Tempe, AZ. The deadline for submission of 
manuscripts is July 01, 2012. Also there are great opportunities provided for 
companies to showcase their products/brands through structured 
sponsorships/exhibitions, details of which can be found in the exhibits 
link<http://epeps.ece.illinois.edu/exhibits.html>. We look forward to your 
participation in this premier conference on signal integrity, interconnects and 
electronic packaging.
For more information, please contact EPEPS administrator, Mandy Wisehart via 
email, epeps-admin@xxxxxxxxxxxx<mailto:epeps-admin@xxxxxxxxxxxx>.
Sincerely,
EPEPS Co-Chairs: Brian Young, Freescale Semiconductor & Kathleen Melde, 
University of Arizona
-----------------------------------------------------------------------------------------------------------------------------------------
21st IEEE International Conference on
Electrical Performance of Electronic Packaging and Systems
EPEPS 2012
October 21-24,     Tempe, AZ
Call for Papers
EPEPS (www.epeps.org<http://www.epeps.org/>) is the premier international 
conference on advanced and emerging issues in electrical modeling, analysis, 
synthesis and design of electronic interconnections, packages and systems. It 
also focuses on new methodologies and CAD/design techniques for evaluating and 
ensuring signal, power and thermal integrity in high-speed designs. EPEPS is 
jointly sponsored by the IEEE Components, Packaging and Manufacturing 
Technology Society and IEEE Microwave Theory and Techniques Society. Authors 
are invited to submit papers describing new technical contributions related to 
the broad area of electrical performance of high-performance interconnect 
systems, covering:

  1.  Emerging and advanced issues
  2.  New design techniques and innovative architectures
  3.  Novel CAD concepts, methodologies and algorithms for modeling, simulation 
and optimization
with emphasis on:

  *   System-level, board-level and on-chip interconnects
  *   High-speed channels, links, backplanes, serial and parallel 
interconnects, SerDes
  *   Low power mobile and personal applications
  *   Multiconductor transmission lines
  *   Memory and DDR interfaces
  *   Jitter and noise management
  *   Signal and thermal integrity
  *   Power integrity and power distribution networks (PDNs)
  *   Electronic packages and microsystems
  *   3D interconnects, 3D packages, TSVs and MCMs
  *   Nano interconnects and nano structures
  *   RF/microwave packaging structures, RFICs, mixed signal modules and 
wireless switches
  *   Package-chip co-design
  *   Electromagnetic (EM) and EM interference modeling, simulation algorithms, 
tools and flows
  *   Macromodeling including model order reduction as it applies to electrical 
analysis
  *   Advanced and parallel CAD techniques for signal, power and thermal 
integrity analysis
  *   Measurement and data analysis techniques for system-level and on-chip 
structures.
For a PDF version of the call for papers, please click 
here<http://epeps.ece.illinois.edu/cfp.pdf>

<http://epeps.ece.illinois.edu/cfp.pdf>Submission Deadline: July 1, 2012, 8pm, 
PST
Submission Format: 2 column, 4 page, PDF format only.

Information for authors can be found at www.epeps.org<http://www.epeps.org/>. 
Submitted manuscripts should be camera ready and compliant with the general 
standards of the IEEE, including appropriate referencing. Noncompliant 
manuscripts will not be considered for review.
Location: Tempe Mission Palms Hotel, 60 East Fifth Street, Tempe, AZ, USA
Tutorials/Workshops: EPEPS offers tutorials on state-of-the-art topics during 
the conference.
Sponsorships/Exhibits: EPEPS offers an excellent opportunity for 
sponsorships/exhibits. EPEPS is an exciting forum for vendors to demonstrate 
their state-of-the-art-tools to the attendees. Interested vendors can contact 
the conference administration for more details.
Conference Co-chairs:

  *   Brian Young, Freescale Semiconductor
  *   Kathleen L. Melde, University of Arizona
For more information, please contact EPEPS administrator, Mandy Wisehart via 
email, epeps-admin@xxxxxxxxxxxx<mailto:epeps-admin@xxxxxxxxxxxx>.

Sent by
Kara MacGregor
Office Administrator


------------------------------------------------------------------
To unsubscribe from si-list:
si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field

or to administer your membership from a web page, go to:
//www.freelists.org/webpage/si-list

For help:
si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field


List forum  is accessible at:
               http://tech.groups.yahoo.com/group/si-list

List archives are viewable at:     
                //www.freelists.org/archives/si-list
 
Old (prior to June 6, 2001) list archives are viewable at:
                http://www.qsl.net/wb6tpu
  

Other related posts: