Dear Members, The call for papers for the 21st Conference on Electrical Performance of Electronic Packaging and Systems is posted at our website http://epeps.org<http://epeps.org/> and can be accessed through the link "call for papers<http://epeps.ece.illinois.edu/papers.html>" . The conference is held during Oct. 21-24, 2012, in Tempe, AZ. The deadline for submission of manuscripts is July 01, 2012. Also there are great opportunities provided for companies to showcase their products/brands through structured sponsorships/exhibitions, details of which can be found in the exhibits link<http://epeps.ece.illinois.edu/exhibits.html>. We look forward to your participation in this premier conference on signal integrity, interconnects and electronic packaging. For more information, please contact EPEPS administrator, Mandy Wisehart via email, epeps-admin@xxxxxxxxxxxx<mailto:epeps-admin@xxxxxxxxxxxx>. Sincerely, EPEPS Co-Chairs: Brian Young, Freescale Semiconductor & Kathleen Melde, University of Arizona ----------------------------------------------------------------------------------------------------------------------------------------- 21st IEEE International Conference on Electrical Performance of Electronic Packaging and Systems EPEPS 2012 October 21-24, Tempe, AZ Call for Papers EPEPS (www.epeps.org<http://www.epeps.org/>) is the premier international conference on advanced and emerging issues in electrical modeling, analysis, synthesis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and CAD/design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology Society and IEEE Microwave Theory and Techniques Society. Authors are invited to submit papers describing new technical contributions related to the broad area of electrical performance of high-performance interconnect systems, covering: 1. Emerging and advanced issues 2. New design techniques and innovative architectures 3. Novel CAD concepts, methodologies and algorithms for modeling, simulation and optimization with emphasis on: * System-level, board-level and on-chip interconnects * High-speed channels, links, backplanes, serial and parallel interconnects, SerDes * Low power mobile and personal applications * Multiconductor transmission lines * Memory and DDR interfaces * Jitter and noise management * Signal and thermal integrity * Power integrity and power distribution networks (PDNs) * Electronic packages and microsystems * 3D interconnects, 3D packages, TSVs and MCMs * Nano interconnects and nano structures * RF/microwave packaging structures, RFICs, mixed signal modules and wireless switches * Package-chip co-design * Electromagnetic (EM) and EM interference modeling, simulation algorithms, tools and flows * Macromodeling including model order reduction as it applies to electrical analysis * Advanced and parallel CAD techniques for signal, power and thermal integrity analysis * Measurement and data analysis techniques for system-level and on-chip structures. For a PDF version of the call for papers, please click here<http://epeps.ece.illinois.edu/cfp.pdf> <http://epeps.ece.illinois.edu/cfp.pdf>Submission Deadline: July 1, 2012, 8pm, PST Submission Format: 2 column, 4 page, PDF format only. Information for authors can be found at www.epeps.org<http://www.epeps.org/>. Submitted manuscripts should be camera ready and compliant with the general standards of the IEEE, including appropriate referencing. Noncompliant manuscripts will not be considered for review. Location: Tempe Mission Palms Hotel, 60 East Fifth Street, Tempe, AZ, USA Tutorials/Workshops: EPEPS offers tutorials on state-of-the-art topics during the conference. Sponsorships/Exhibits: EPEPS offers an excellent opportunity for sponsorships/exhibits. EPEPS is an exciting forum for vendors to demonstrate their state-of-the-art-tools to the attendees. Interested vendors can contact the conference administration for more details. Conference Co-chairs: * Brian Young, Freescale Semiconductor * Kathleen L. Melde, University of Arizona For more information, please contact EPEPS administrator, Mandy Wisehart via email, epeps-admin@xxxxxxxxxxxx<mailto:epeps-admin@xxxxxxxxxxxx>. Sent by Kara MacGregor Office Administrator ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List forum is accessible at: http://tech.groups.yahoo.com/group/si-list List archives are viewable at: //www.freelists.org/archives/si-list Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu