Hi, I've got an easy Friday question. When it's time to design board with multi-gigabit (> 5Gb) differential signal, we always get lost into a discussion with CAD guys. We want more trace width to reduce loss and they want more real-estate to fit everything. In that case, increasing dielectric thickness is not an option because it will ruin the rest of the layer trace-2-trace clearance. In the end, we're stuck with a 6 mils trace that will handle a 10G signal. We know, from previous design, that it's working, but I'm not sure if this is good practice. We have to go into 10 ~ 15 inch of routing with interconnect. Is there a rule of thumbs about trace width and signal speed? When Skin effect become a problematic issue? Many thanks, Marc-André Filion ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.net List archives are viewable at: //www.freelists.org/archives/si-list Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu