[SI-LIST] Re: 10 Layer Stack-up board/TWR PCB

  • From: "Stefan Milnor" <stefan.milnor@xxxxxxxxxxxxxx>
  • To: "Jory McKinley" <jory_mckinley@xxxxxxxxx>, "Jayasuryan KG" <suryan_tvm@xxxxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
  • Date: Mon, 31 Oct 2011 12:21:47 -0700

Doesn't this go against the "balanced construction" advice one usually gets 
from PCB vendors? 

-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] On 
Behalf Of Jory McKinley
Sent: Monday, October 31, 2011 11:54 AM
To: Jayasuryan KG; si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Re: 10 Layer Stack-up board/TWR PCB


I would consider better power/gnd return, keep in mind loop inductance to 
appropriate power (TOP/BOTTOM) placement, you can swap power planes where 
needed.  This will reduce retrun path discontinuity and potential cavity 
resonance.  Make sure to include z-axis via retrun stitching.

TOP

GND1

DVDD1_2/D2VDD1_2/DVDD1_8

GND

SIG1/SIG2

GND

DVDD5/DVDD3_3

GND

SIG3/SIG4

BOTTOM

-Jory


From: Jayasuryan KG <suryan_tvm@xxxxxxxxxxx>
To: si-list@xxxxxxxxxxxxx
Sent: Monday, October 31, 2011 12:39 PM
Subject: [SI-LIST] 10 Layer Stack-up board/TWR PCB

Dear Experts,


I have a question regarding my Through Wall Radio(TWR) PCB. My stack-up is as 
follows.



TOP

GND1

SIG1/DVDD1_8 

SIG2/DVDD1_2

PWR1/DVDD3_3

PWR2/DVDD5

SIG3/D2VDD1_2 

SIG4/DVDD5

GND2

BOTTOM



Max current in this board is less than 1A and interfaces like ADC,DAC and video 
signals. 

Also my RF interfaces are going on the top portion of the board, which is 
completely isolated form others and running under GND plane. (find the link for 
pictures) 



https://picasaweb.google.com/104062213607119029710/October312011#5669711738723806994

https://picasaweb.google.com/104062213607119029710/October312011#5669711807720941682



I am wondering is there any issue, if I split the power planes like the above 
layer stack-up? Or any can give better suggestions! 



Looking for your valuable help. 



Best Regards,

- Jayasuryan 




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