[SI-LIST] Re: 0.9 mil,0.8 mil,0.7mil gold wire application for IC packaging
- From: "Barnes, Heidi" <heidi.barnes@xxxxxxxxxx>
- To: <Devis.Lu@xxxxxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
- Date: Tue, 22 Jan 2008 09:30:02 -0600
Hi Davis,
The smaller Au 0.7 mil wire has been used extensively for micro circuits =
in the 10 Ghz range and higher with no problems. The trick is to =
realize that the currents tend to have a bit higher density on the =
outside edges of the microstrip as one goes up in frequency and the =
bigger benefit is to use two wire bonds to go from each edge of the =
microstrip to the pad on the device. The two wires lower the inductance =
far more then a wider diameter wire and also provide a better path for =
the signal currents. If the pad is too small.... there have been cases =
of stacked bonds to accommodate the two wires. At even higher =
frequencies, one typically switches to ribbon bonding or strips of wire =
mesh cut to a desired shape rather then increasing the wire diameter.
The other issue is current carrying capacity, but again one can double =
up on the bonds if the 0.7mil is not enough. =20
As for a rule...it always depends on the application and one should use =
a 3DEM simulator to find the electrical properties of the wire bond in =
the environment that it is being used in.
Goodluck on the bonding,
Heidi
-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] =
On Behalf Of Lu, Devis
Sent: Monday, January 21, 2008 5:11 PM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] 0.9 mil,0.8 mil,0.7mil gold wire application for IC =
packaging
Dear si-listers:
As Gold wire price keep increasing in recent year, we are working on
evaluate 0.9mil,0.8mil, and 0.7 mil gold wire for wirebonding MCP
package. But we have some SI concerns if we reduce the gold wire
diameters although our current product speed is only 133MHZ . Does
anyone have study this before,and come out design rule Gold Wire
Diameter Vs max wire length?
Regards
Davis
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=20
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