Hello, I am currently working on a design where a 0.8 mm pitch BGA package is used. Can any one suggest me the design configuration i.e trace width/spce and specially the via size and via hole, which i should follow and manufacturers can handle this. Regards Tayyab Jamil Qureshi Sr. Design Engineer CARE Pvt. Ltd. ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: http://www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.org List archives are viewable at: http://www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu