[SI-LIST] 0402 capacitors and 1mm pitch BGAs
- From: Bob McNamara <electronbob2@xxxxxxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Wed, 28 Apr 2004 10:26:36 -0700 (PDT)
Hi SI-Listers,
I'm looking for feedback on producibility or other
concerns regarding the use of 0402 capacitors with
a 4 via footprint on a 1.0mm grid. From measured
data provided in Lee Ritchey's book "Right the
First Time", this footprint yields a mounted ESL
of about 450pH (for a via length of 13.5 mils).
Even better, it fits the pitch of a 1mm BGA. For
a fully populated BGA, the only alternative
decoupling schemes I can come up with are:
1) blind vias, a good solution electrically but
not so great economically.
2) via-in-pad, maybe the best solution
electrically but not so economical.
3) via sharing to open up areas to place
capacitors. very economical, but a definite
compromise electrically.
For a high performance chip in a 1mm BGA package
that requires low-inductance decoupling, dropping
0402 capacitors in between the BGA's dispersion
vias seems to me to be the best engineering
choice. Even if a higher defect rate means that 1
of the 50 caps on an occasional board has an open
solder joint, I'd claim that board has better
electrical margins than a perfect board designed
with compromised electricals to start with.
What do others think? To help visualize the cap
and its footprint, I've uploaded a picture to:
http://briefcase.yahoo.com/electronbob2@xxxxxxxxxxxxx?.dir=0402
There are two resolutions: 800x600 (about 85x
magnification assuming a 100dpi screen) and
2032x1524 (about 220x magnification on a 100dpi
screen).
Bob
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- [SI-LIST] Re: 0402 capacitors and 1mm pitch BGAs
- From: steve weir
Other related posts:
- » [SI-LIST] 0402 capacitors and 1mm pitch BGAs
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- [SI-LIST] Re: 0402 capacitors and 1mm pitch BGAs
- From: steve weir