[jsfg_cinti] High Speed Digital Design Engineer - dayton
- From: "mredd" <mredd@xxxxxxxxxxxxxxxxx>
- To: <jsfg_cinti@xxxxxxxxxxxxx>
- Date: Mon, 31 Mar 2003 23:01:38 -0500
Job Title High Speed Digital Design Engineer
Job ID: jr.3787.1419
Company: Recruiting Services, Inc.
Location: Dayton, Ohio USA
Salary: $75000 - 85000
Industry:
Function:
Name:
Phone: 513-721-3030
Fax: 513-721-2010
Email:
Description:
Job description: Candidates will be responsible for designing PCBs that
contain analog and high-speed digital circuits. A variety of different
integrated circuit technologies and voltage levels may be employed depending on
the application. Candidates will work with systems engineers to translate
system requirements into FPGA/ASIC/board-level requirements, functional and
performance specifications and then into realizable designs. Candidates will
interface directly with PCB layout staff and fabrication houses in order to
translate in-house designs into fabricated PCBs. Upon delivery of completed
boards, candidates will be responsible for board-level integration and test.
Applicant selected will be subject to a security investigation and must meet
eligibility requirements for access to classified information.
Requirements:
Requirements: - BS in Electrical Engineering required; MS in Electrical
Engineering desired. - 5 years of board-level digital design experience and
board-level integration and test. - Experience shall include a detailed
knowledge of high-speed digital design and signal integrity analysis and
simulation. A specific working knowledge of Mentor schematic capture and signal
integrity analysis design tools is preferred. - Additional experience with
high-speed digital design of FPGAs using Verilog/VHDL design methodology and
board-level circuit design with FPGAs, ASICs and discrete logic is a plus. Must
be a U.S. Citizen and meet eligibility requirements for access to classified
information
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