[jsfg_cinti] Electronic Packaging Design Engineer - cincy

      Job Title Electronic Packaging Design Engineer 
      Job ID: bhrtpkgengr016 bhrtpkgengr016 
      Company: Russ Hadick and Associates, Inc. 
      Location: Cincinnati, Ohio USA 
      Salary: $80000 - 90000 
      Industry:  
      Function:  
      Name:  
      Phone: 937-439-7700 
      Fax: 937-439-7705 
      Email:  
      Description:   
      Are you a highly experienced Design Engineer who is tired of sitting on 
the sideline while others make a significant contributions in the War Against 
Terrorism. Do you want a play a role in ousting Saddam or bringing justice to 
Al-Queda? If this is you then be prepared for a great opportunity! Join the 
Effort by working for a On-the- Bleeding-Edge, Defense contractor who is 
ACTIVELY ENGAGED IN THE WAR EFFORT?!! We are offering the perfect opportunity 
for the patriotic individual who wants to help defeat terrorism through the use 
of his/her hi-tech skills. Also, if you are you tired of recruiters posting 
jobs and not really having the jobs or not telling you the name of company to 
which they are presenting you? Are you tired of sending your resume directly 
into a company's HR representative who thinks assembly language is the language 
of Union workers and therefore your resume goes on the pile with the 100's of 
others? Or do you send your resume into a recruiter whose background was in HR, 
or sales, or some non-technical background who thinks real-time is what your 
watch reads? If you want to be represented by a recruiter who has a Engineering 
Degree and has been a Director of Engineering over 55 engineers and can talk 
the talk to properly represent you, then send your resume if you fit the 
following qualifications Your primary duties will include package design from 
proposal support through analysis, development, qualification testing and 
transition to production. Pay is 80k-90k. Must be able to get a security 
clearance.  
      Requirements:   
      You MUST have extensive experience in electronic packaging design; 
Experience using various 3-D CAD applications and MS Office is required but 
Knowledge of finite element thermal and structural analysis is an absolute MUST 
. You must have great communication and people skills since you will work on a 
multi-disciplinary product development team.  

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