[PCB_FORUM] package spacing

Hi All,
We use a .150 keepout around bga's for rework, but also for qfn's (.250 square device 19 mil pin pitch). My previous company did not use such a large keepout for qfn's. It was 50 mil package to package as opposed to 150. It seems this large rework keepout cancels out the benefit of using a small package. What are others using as their place bound?
Is there a pcb forum that is not specific to Allegro that anyone uses for general questions? It seems most of the ones I've found are not well attended and have few recent postings. 

Thanks,
Rachel

_________________________________________________________________
Add a Yahoo! contact to Windows Live Messenger for a chance to win a free trip! http://www.imagine-windowslive.com/minisites/yahoo/default.aspx?locale=en-us&hmtagline 

-----------------------------------------------------------
To subscribe/unsubscribe: Send a message to icu-pcb-forum-request@xxxxxxxxxxxxx 
with a subject of subscribe or unsubscribe

To view the archives of this list go to 
http://www.freelists.org/archives/icu-pcb-forum/

Problems or Questions:
Send an email to icu-pcb-forum-admins@xxxxxxxxxxxxx
-----------------------------------------------------------

Other related posts: