[PCB_FORUM] manual void in cross-hatch dynamic in Allegro

Hi,
   
  I would like to know if anyone have experienced this.  I have a dynamic solid 
shape for power signal.  I voided a power via using manual void.  However, when 
I change this solid dynamic to xhatch dynamic, the thermal ties appear for this 
via.  
   
  It looks to me that the manual void has lost its functionality in xhatch 
dynamic.  
  But when I checked with Cadence support and the reply was that 
  "There is a difference in the full contact option between solid and xhatch 
shapes. With solid shapes no thermals are added but for xhatch shapes thermals 
are added if the algorithm permits.  This is because the pin/via may be located 
inside of
the xhatch".  Can anyone comment on that?
   
   
  Regards,
  Stella

                
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