Been mask vias on both sides with immersion gold boards for many years. It all depends on if your mission is to put additional plating down the barrel of the via or not. 70% of the industry masks over vias both sides (consumer products). The rest are medical, space and military applications....they require additional plating for reliability. JL From: icu-pcb-forum-bounce@xxxxxxxxxxxxx [mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of O Migs Sent: Monday, March 28, 2011 9:11 PM To: icu-pcb-forum@xxxxxxxxxxxxx Subject: [PCB_FORUM] Re: Vias too close to Gold plated edge connectors you can't mask a via on both sides assuming the gold fingers are on double sides. via fill first, then mask. if you want to save cost, encroach the via mask opening 6 mil larger than the drill and shift via far enough from the gold. br, -oscar On Mon, Mar 28, 2011 at 8:00 AM, Mark Salberg <msalberg@xxxxxxxxxxxx<mailto:msalberg@xxxxxxxxxxxx>> wrote: Hi Mashak, Thanks for the reply. Does "close the mask" mean "tent the vias"? Why would it cost more to allow vias to plate? Thanks, Mark On 3/28/2011 9:41 AM, Maqbool, Mashak (GE Energy) wrote: Hi, Just close the mask for the Vias which are close to the Gold Fingers. This will save you additional cost. Regards, Mashak Maqbool ________________________________ From: icu-pcb-forum-bounce@xxxxxxxxxxxxx<mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx> [mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of Mark Salberg Sent: Monday, March 28, 2011 7:00 PM To: Cadence User Group Subject: [PCB_FORUM] Vias too close to Gold plated edge connectors Hi all, Can anyone tell me concerns about vias being "too close" (.8mm or .031") to gold plated edge connectors in PCB fabrication? I know that vias "too close" will be plated Nickel / gold. Does this create any concerns of integrity? I would like to minimize redundant replies from vendors which delay the delivery. Any feedback is appreciated. Thanks, Mark See image below. We have a via keep out in our lib parts set to 20 mil above plated pins. Our vendor response is as follows: The via solder mask opening is too close to the gold fingers, so it will be plated Ni, Au. And also the via pad will have immersion gold when we are plating surface treatment. We suggest to cancel the via holes solder mask opening where the distance is less than 0.8mm to the gold fingers. Their suggestion is: A. Accept our suggestion. B. Follow Gerber, but accept the via pads will be plated Ni, Au.