you can't mask a via on both sides assuming the gold fingers are on double sides. via fill first, then mask. if you want to save cost, encroach the via mask opening 6 mil larger than the drill and shift via far enough from the gold. br, -oscar On Mon, Mar 28, 2011 at 8:00 AM, Mark Salberg <msalberg@xxxxxxxxxxxx> wrote: > Hi Mashak, > Thanks for the reply. > Does "close the mask" mean "tent the vias"? > Why would it cost more to allow vias to plate? > > Thanks, > Mark > > > > On 3/28/2011 9:41 AM, Maqbool, Mashak (GE Energy) wrote: > > Hi, > > Just close the mask for the Vias which are close to the Gold Fingers. This > will save you additional cost. > > Regards, > *Mashak Maqbool* > > ------------------------------ > *From:* icu-pcb-forum-bounce@xxxxxxxxxxxxx [ > mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx<icu-pcb-forum-bounce@xxxxxxxxxxxxx>] > *On Behalf Of *Mark Salberg > *Sent:* Monday, March 28, 2011 7:00 PM > *To:* Cadence User Group > *Subject:* [PCB_FORUM] Vias too close to Gold plated edge connectors > > Hi all, > Can anyone tell me concerns about vias being "too close" (.8mm or .031") to > gold plated edge connectors in PCB fabrication? > I know that vias "too close" will be plated Nickel / gold. Does this create > any concerns of integrity? > I would like to minimize redundant replies from vendors which delay the > delivery. > Any feedback is appreciated. > > Thanks, > Mark > > See image below. > We have a via keep out in our lib parts set to 20 mil above plated pins. > Our vendor response is as follows: > *The via solder mask opening is too close to the gold fingers, so it will > be plated Ni, Au. > And also the via pad will have immersion gold when we are plating surface > treatment. > We suggest to cancel the via holes solder mask opening where the distance > is less than 0.8mm to the gold fingers.* > > Their suggestion is:* > A. Accept our suggestion. > B. Follow Gerber, but accept the via pads will be plated Ni, Au.* > > >