[PCB_FORUM] Via-In-Pad versus MicroVia

Dear Forum,

 

I am placing a Very Small PCB with a Very High Pin Density in some areas
(700+ Pins Per Square Inch).

 

I believe I will be obligated to employ Via-In-Pad and/or MicroVias.

 

Are there pros and cons to these similar methodologies?

 

It seems to me that MicroVias would be more versatile, i.e. "movable"
relative to an array of Buried Vias.

 

The Via-In-Pad would seem to be useful for High Density SMT Connectors where
the leads could interfere with placing any sort of Vias "inside" the Dual
Rows.

 

Thank You In Advance,

 

Richard E Marion

169 Little Mill Road Unit 2

Sandown NH 03873-2554

HOME: 603-887-2266

CELL: 603-247-1610

FAX : 603-887-2936

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