[PCB_FORUM] Re: Via-In-Pad

Hi Alexis,

 

I have used via-in-pad quite a bit.  We epoxy fill the via and then plate
over.  It is important that the Tg of the epoxy be near equivalent to the Tg
of the FR4 so that expansion and contraction are similar so as not to pop
the pad during the reflow process.

 

                                    Phil

 

 

  _____  

From: icu-pcb-forum-bounce@xxxxxxxxxxxxx
[mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of
ameehan@xxxxxxxxxxxxxx
Sent: Wednesday, January 28, 2009 8:23 PM
To: icu-pcb-forum@xxxxxxxxxxxxx
Subject: [PCB_FORUM] Via-In-Pad

 

One of our engineers has asked if we can implement via-in-pad on a handful
of 0603 pads to facilitate routing of critical lines. We've never done it
here before, and I know that it increases both fab and assembly costs. I'm
also concerned about the risks involved (trapped solvents, rising via plugs,
etc). Has anyone out there used this technology on only a few components
with success (and minimal problems)? I'm not sure if we should be doing this
on a layout spin that needs to be our production version. Thanks in advance
for any feedback.

Alexis Meehan

Opnext Subsystems, Inc.

Desk: 408-385-3040

 

----------------------------------------------------------- To
subscribe/unsubscribe: Send a message to icu-pcb-forum-request@xxxxxxxxxxxxx
with a subject of subscribe or unsubscribe To view the archives of this list
go to http://www.freelists.org/archives/icu-pcb-forum/ Problems or
Questions: Send an email to icu-pcb-forum-admins@xxxxxxxxxxxxx
-----------------------------------------------------------

Other related posts: