[PCB_FORUM] Re: Thermal Pad Design

I use OD = 5 mil over pad size, and ID 5 mil under pad size,
ie, 40 mil FHS with 60 mil pad would have 65/55 thermal, obviously this
doesn't work exactly on pins with excessively large pads.

________________________________

From: icu-pcb-forum-bounce@xxxxxxxxxxxxx
[mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of jeff
Sent: Tuesday, September 09, 2008 10:19 AM
To: icu-pcb-forum@xxxxxxxxxxxxx
Subject: [PCB_FORUM] Thermal Pad Design


Could I get some feedback on what is being used for a thermal pad on a
negative inner layer for component through holes( not vias)? 
What ID is used over the finished hole size? And What OD is used over
the ID? 
 
Jeff

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