[PCB_FORUM] Re: Thermal Pad Design
- From: gnieski_mike@xxxxxxx
- To: <icu-pcb-forum@xxxxxxxxxxxxx>
- Date: Tue, 9 Sep 2008 10:23:38 -0400
Here is a Sanmina design guideline has their take on thermals
________________________________
From: icu-pcb-forum-bounce@xxxxxxxxxxxxx
[mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of jeff
Sent: Tuesday, September 09, 2008 10:19 AM
To: icu-pcb-forum@xxxxxxxxxxxxx
Subject: [PCB_FORUM] Thermal Pad Design
Could I get some feedback on what is being used for a thermal pad on a
negative inner layer for component through holes( not vias)?
What ID is used over the finished hole size? And What OD is used over
the ID?
Jeff
- References:
- [PCB_FORUM] Thermal Pad Design
- From: jeff
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- » [PCB_FORUM] Re: Thermal Pad Design
- [PCB_FORUM] Thermal Pad Design
- From: jeff