[PCB_FORUM] Re: Test Prep parameter setup problem.
- From: "Dave Mattice" <DMattice@xxxxxxxxxxxxxxxxx>
- To: <icu-pcb-forum@xxxxxxxxxxxxx>
- Date: Mon, 21 Aug 2006 13:40:17 -0700
But Carl, you have to admit that Jean is great at clip art.
Jean, I LOVE the RED arrow.
:-)
-----Original Message-----
From: icu-pcb-forum-bounce@xxxxxxxxxxxxx
[mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx]On Behalf Of Musetti, Carl
Sent: Monday, August 21, 2006 11:18 AM
To: icu-pcb-forum@xxxxxxxxxxxxx
Subject: [PCB_FORUM] Re: Test Prep parameter setup problem.
No this does not solve the problem.
_____
From: icu-pcb-forum-bounce@xxxxxxxxxxxxx
[mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of Jean Bratton
Sent: Friday, August 18, 2006 9:09 PM
To: icu-pcb-forum@xxxxxxxxxxxxx
Subject: [PCB_FORUM] Re: Test Prep parameter setup problem.
The "replace via" option is in the Testprep Parameters form. However, I suspect
that's not Carl's problem. I'm on 15.5.1 S050, and I can't duplicate the
problem. I can close the form whether this box is checked off or not.
_____
From: icu-pcb-forum-bounce@xxxxxxxxxxxxx
[mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of David Kelly (davidkel)
Sent: Friday, August 18, 2006 4:59 PM
To: icu-pcb-forum@xxxxxxxxxxxxx
Subject: [PCB_FORUM] Re: Test Prep parameter setup problem.
I'm new to 15.5.1 and haven't tried test prep yet. I looked at it and tried to
duplicate what you are doing.
I had the same problem. What is missing or has been moved is "replace via"
Without this parameter
it will fail unless you are routing with the test via.
David Kelly
davidkel@xxxxxxxxx
720-562-6316
_____
From: icu-pcb-forum-bounce@xxxxxxxxxxxxx
[mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of Musetti, Carl
Sent: Friday, August 18, 2006 1:59 PM
To: icu-pcb-forum@xxxxxxxxxxxxx
Subject: [PCB_FORUM] Test Prep parameter setup problem.
I have a board that is backwards the major components are on the bottom
side so we want to do the ICT test from the top of the board. When we change
the methodology layer to the top and the restriction of allow under componenet
to bottom layer only then put in our padstacks for pins which is a top side pad
of 35 and for vias it is a 12 drill 35 pad on the top side 24 pad on all other
layers except planes and masks. The minimum pad size is set to 30 whenwe go to
close the form it states that pad size is too small for vias and pins and will
not close the form. I have done this on other designs in 15.5.1 oh yeah we are
on 15.5.1 S051, so it has got to be something stupid here.
What have when done wrong is there some other setting or env variable that
needs t be turned on to allow this to happen.
Thanks all in advance
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