[PCB_FORUM] ICT
- From: Mark Salberg <msalberg@xxxxxxxxxxxx>
- To: Cadence User Group <icu-pcb-forum@xxxxxxxxxxxxx>
- Date: Wed, 13 Sep 2006 09:00:56 -0400
Hello group,
We are using ICT more and more and would like to find out what the most
efficient way to do this.
Is it better to route the board then run ICT ?
Or place components, fanout all signals to bottom side, run ICT then
route the board?
Is it easier in Specctra or Allegro?
Is there a way in Allegro to give all testpoints a temporary place
holder to ensure a TP location after routing.
Currently, we are routing the board, Run ICT to replace vias as TPs
where it can. Then run a pass to add TP "pads" with no drill on bottom
side. Trying to allow on traces where it can. Then run again allowing
stringers to these pads.
Any comments would be appreciated.
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