[PCB_FORUM] BGA Fanout / Filled vias

  • From: Mark Salberg <msalberg@xxxxxxxxxxxx>
  • To: Cadence User Group <icu-pcb-forum@xxxxxxxxxxxxx>
  • Date: Thu, 16 Feb 2006 04:25:03 -0500

Hello all,
What BGA Ball pad to via clearance is needed for BGA fanout?
Our Assembly house is telling us that we need 10 mil copper to copper (15mil preferred).
On 1mm BGA's using an 18mil via with 8mil drill gets us 9.8mil via to pad.
On our .75mm BGA this via gets us 4mil via to pad. Which also breaks the soldermask dam.

Is epoxy filled and tented vias our best or only option at this point?

Thanks for any input.
Mark


_____________________________________________________________________________
Scanned by IBM Email Security Management Services powered by MessageLabs. For more information please visit http://www.ers.ibm.com
_____________________________________________________________________________
-----------------------------------------------------------
To subscribe/unsubscribe: Send a message to icu-pcb-forum-request@xxxxxxxxxxxxx
with a subject of subscribe or unsubscribe

To view the archives of this list please login at
//www.freelists.org. Our list name is icu-pcb-forum
or go to //www.freelists.org/archives/icu-pcb-forum/

Problems or Questions:
        Send an email to icu-pcb-forum-admins@xxxxxxxxxxxxx

Want to post a job listing ? DON'T DO IT HERE! Better yet, join our jobs listing forum.

SUBSCRIBE:  icu-jobs-forum-subscribe@xxxxxxxxxx
POST:       icu-jobs-forum@xxxxxxxxxx
-----------------------------------------------------------

Other related posts:

  1. Home
  2. icu-pcb-forum
  3. Archive
  4. 02-2006