[PCB_FORUM] 答复: About Thermal Pad Land pattern
- From: <Luo.Yu-Ming@xxxxxxxxxxxxxxxx>
- To: <icu-pcb-forum@xxxxxxxxxxxxx>
- Date: Thu, 2 Jul 2009 08:51:24 +0800
Hi, Matija,
Thanks, I think the checkered field pattern for the "solder(mask)" you
mentioned means the SMT paste stencil pattern should be checkered fileld, if
so, that's exact what we have done for so many years.
Best Regards,
Luo.
________________________________
发件人: Milostnik Matija [mailto:milostnik@xxxxxxxxxxx]
发送时间: 2009年7月1日 16:55
收件人: Luo, Yu-Ming (?_玉茗 IAC-N)
主题: [PCB_FORUM] About Thermal Pad Land pattern
Hello,
we do a square for the pad, and a checkered field for the solder (mask). Thus
the solder can spread in the spaces inbetween.
Hope this helps
Matija Milostnik
Head PCB group
Iskratel, d.o.o., Kranj
Ljubljanska c. 24a, SI 4000 Kranj, Slovenia
phone: +386 (0)4 207 21 25, fax: +386 (0)4 207 27 12, e-mail:
milostnik@xxxxxxxxxxx <mailto:milostnik@xxxxxxxxxxx> , website:
www.iskratel.com <http://www.iskratel.com/>
Iskratel group
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Hi, All,
Usually, we design thermal pad land pattern as same size as the chip thermal
pad. Now our SMT engineer suggest separating the thermal pad to several little
rectangle area with soldmask on board, to increase joint area. Are you doing
like this? What is the benefit and risk? where can I get any article for
reference?
Thanks a lot. Any input would be great appreciate.
Best Regards,
Luo.
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