[PCB_FORUM] Re: About Thermal Pad Land pattern

Hi, Tony,
 
Thank you very very much, the attached files are very helpful, I will study 
them with our SMT guys to improve thermal pad reflow. thanks again.
 
Have a nice day! :-)
 
Best Regards,
Luo.
 

________________________________

发件人: Cosentino, Tony [mailto:Tony.Cosentino@xxxxxxxxxxx] 
发送时间: 2009年7月1日 20:35
收件人: Luo, Yu-Ming (?_玉茗 IAC-N)
主题: RE: [PCB_FORUM] About Thermal Pad Land pattern


Luo, 
 
Please see the attached file and focus on the Thermal Pad stencil design 
techniques used. You will find it is not the copper thermal pad that is being 
partitioned - it is the solder paste shape that is being partitioned. See 
examples in attached zip.
 
Thanks
Tony Cosentino
Tekelec 
________________________________

From: icu-pcb-forum-bounce@xxxxxxxxxxxxx 
[mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of 
Luo.Yu-Ming@xxxxxxxxxxxxxxxx
Sent: Wednesday, July 01, 2009 4:49 AM
To: icu-pcb-forum@xxxxxxxxxxxxx
Subject: [PCB_FORUM] About Thermal Pad Land pattern


Hi, All,
 
Usually, we design thermal pad land pattern as same size as the chip thermal 
pad. Now our SMT engineer suggest separating the  thermal pad to several little 
rectangle area with soldmask on board, to increase joint area. Are you doing 
like this? What is the benefit and risk? where can I get any article for 
reference?
 
Thanks a lot. Any input would be great appreciate.
 
Best Regards,
Luo.

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