[PCB_FORUM] About Thermal Pad Land pattern

From: <Luo.Yu-Ming@xxxxxxxxxxxxxxxx>
To: <icu-pcb-forum@xxxxxxxxxxxxx>
Date: Wed, 1 Jul 2009 16:48:42 +0800

Hi, All,
 
Usually, we design thermal pad land pattern as same size as the chip thermal 
pad. Now our SMT engineer suggest separating the  thermal pad to several little 
rectangle area with soldmask on board, to increase joint area. Are you doing 
like this? What is the benefit and risk? where can I get any article for 
reference?
 
Thanks a lot. Any input would be great appreciate.
 
Best Regards,
Luo.

Follow-Ups:

[PCB_FORUM] Re: About Thermal Pad Land pattern
From: Dave Seymour

[PCB_FORUM] Re: About Thermal Pad Land pattern
From: Dave Seymour

[PCB_FORUM] About Thermal Pad Land pattern

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