[PCB_FORUM] .4mm to .3mm

Group


Our factory is concerned with the collapsed ball to package edge distance being 
50um beyond the minimum spec.

However, the current spacing allows for 200um above the singulation tolerance, 
so we have a good chance to obtain their acceptance.



The factory suggests reducing the ball size from .40mm to .30mm to fully comply 
with their requirements.

Is this option available from you, or should I work with the factory to get 
approval using the .4mm ball?



Any problems with the ball going to 0.3mm? (This is the 13x13mm package for , 
16x16 ball array with 0.8mm pitch)

These are a couple of questions from package manufactorer. I don't see any 
problems with .4 or .3, The distance of .8 pitch remains the same and I believe 
this might mean less solder on the balls but the assembly house most likely can 
deal with this. Any thoughts, anyone?

Thanks. 


Any problems with the ball going to 0.3mm? (This is the 13x13mm package for , 
16x16 ball array with 0.8mm pitch)

These are a couple of questions from package manufactorer. I don't see any 
problems with .4 or .3, The distance of .8 pitch remains the same and I believe 
this might mean less solder on the balls but the assembly house most likely can 
deal with this. Any thoughts, anyone?

Thanks. 

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