[PCB_FORUM] Re: 0402 round pads

  • From: "richard moffat" <richard.moffat@xxxxxxxxxxxxxxxxxxx>
  • To: <icu-pcb-forum@xxxxxxxxxxxxx>
  • Date: Tue, 09 Jan 2007 10:35:09 +1300

Knowing the Patents Office, it's probably includes something like:

"... any methods of adhesion, joining, or amalgamation of
electron-conveying materials (including metals and semiconductors) , and
the henceforth positioning of materials thereof."  


PS - Happy New Year, everyone!





  
__________________________
Richard Moffat
PCB CAD Team Leader
Allied Telesis Labs
ph. +64 (3) 3393000
richard.moffat@xxxxxxxxxxxxxxxxxxx

>>> "Austin Franklin" <allegrolist@xxxxxxxxxxxx> 9/01/2007 10:16 a.m.
>>>
Hi Jelena,

Do you have any more info on the patent, like the patent number, or
what it
is that they are claiming patent to?

Regards,

Austin

> -----Original Message-----
> From: icu-pcb-forum-bounce@xxxxxxxxxxxxx 
> [mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx]On Behalf Of Jelena
Larsen
> Sent: Monday, January 08, 2007 2:54 PM
> To: icu-pcb-forum@xxxxxxxxxxxxx 
> Subject: [PCB_FORUM] Re: 0402 round pads
>
>
> Hi Austin,
>
>    Indeed I am. Amazing what gets patented.
>
> -----Original Message-----
> From: icu-pcb-forum-bounce@xxxxxxxxxxxxx 
> [mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of Austin
Franklin
> Sent: Friday, January 05, 2007 5:57 PM
> To: icu-pcb-forum@xxxxxxxxxxxxx 
> Subject: [PCB_FORUM] Re: 0402 round pads
>
> Hi Jelena,
>
> > If you get a chance look at an XBOX360 motherboard, bottom side
> under the
> > CPU. An array of 0402 bypass caps side by side tied to the plane
with a
> > standard via 10mil finished drill size. No tombstone issues.
> Manufacturing
> tested.
>
> > Patented design.
>
> Patented?  Are you serious?
>
> Regards,
>
> Austin
>
>
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