The IBIS Open Forum is pleased to announce our IBIS Summit meeting at
DesignCon 2017. The Summit will be held in Santa Clara, California,
on Friday, February 3, 2017. Some tentative topics are listed below.
NOTE: The IBIS summit takes place AFTER the last day of DesignCon.
Please remember to consider this in your travel plans.
IBIS Summits are designed to enable face-to-face interactions between
Model users, model makers and EDA tool developers in the IBIS community.
Those interested in presenting at or in attending the event may register
using the information below.
The IBIS Open Forum is sponsoring the event, but we welcome additional
sponsors to cover some of the meeting expenses, including the FREE lunch
and refreshments.
We look forward to seeing you in Santa Clara!
Best Regards,
Mike LaBonte
SiSoft
Chair, IBIS Open Forum
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DESIGNCON 2017 IBIS SUMMIT
FOURTH CALL FOR
PARTICIPATION & PRESENTATIONS
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Time/Date: Friday, February 3, 2017 8:00 AM to 5:00 PM
Location: Santa Clara Convention Center
5101 Great America Parkway
Santa Clara, California 95054
Room: 209
Content: Presentations and Discussions
Cost: FREE
Sponsors: IBIS Open Forum, UBM
Cadence Design Systems
Mentor Graphics Corporation
Keysight Technologies
Synopsys
We are seeking more co-sponsors. The benefits to sponsors include
recognition at the meeting and acknowledgement in the calls for
participation and presentations.
Your financial support strengthens the organization by allowing
IBIS to focus resources on industry activities rather than raising
money. You will receive generous thanks and public acknowledgement
for your support.
Please contact Mike LaBonte <mlabonte@xxxxxxxxxx> for
co-sponsorship information.
DesignCon 2017: January 31 - February 2, 2017
Santa Clara Convention Center
5001 Great America Parkway
Santa Clara, California 95054
http://www.designcon.com/ ;
Use promo code IBIS20 for 20% discount on DesignCon registration!
https://designcon.tech.ubm.com/2017/registrations/Main?mc=barter_x_dc_le_a
ud_dc_x_x-IBISeNL
Conference Schedule:
http://www.designcon.com/santaclara/scheduler/list
BACKGROUND
DesignCon is the premier annual Silicon Valley event for the electronic
design automation (EDA) and semiconductor industry. Topics of current
interest to the IBIS Open Forum are addressed at DesignCon.
This meeting will be conducted as a formal IBIS meeting.
Presentations are expected to be available in an electronic format,
and minutes of the meeting will be issued. Any pending formal decisions
(votes) will be announced at least two weeks prior to the meeting.
CALL FOR PARTICIPANTS
People involved in IBIS or related model development, EDA tool
development, and digital circuit design are invited to participate in
the Summit meeting. If you plan to participate, please register with
the information below:
Name:
E-mail address:
Company:
Send your registration information to Lance Wang <lwang@xxxxxxxxxx>
Deadline: Friday, January 27, 2017 to receive the free lunch.
CALL FOR PRESENTATIONS
We are seeking presentations from individuals who have experiences
of interest to the IBIS modeling community. These can include, but
are not limited to:
Demonstrations of modeling techniques
Explanations of behavioral algorithms
Descriptions of difficulties encountered
Model correlation
Modeling building experiences
Comparisons to other modeling methods
New technologies for modeling buffers and components
New technologies for modeling packaging and interconnects
Algorithmic modeling topics
Ideas for IBIS model users
Presentations may be addressed to any and all levels of IBIS
experience, from beginner to expert.
Presentation Format:
Microsoft PowerPoint* or Adobe Acrobat* electronic formats are
favored and will be pre-loaded on a Microsoft Windows*-based
meeting laptop prior to the meeting. Materials will be projected
but handouts or other physical media are welcome.
Time: Usually 15-45 minutes (allow time for questions)
Electronic Archival:
Presentations will be archived under the IBIS Summit website.
Final submission deadline is Friday, January 20, 2017
If you plan a presentation, please supply the following information
as soon as possible:
Presentation Title:
Author Name(s):
E-mail address:
Company:
Estimated Time:
Send your presentation to Mike LaBonte <mlabonte@xxxxxxxxxx>
Deadline: Friday, January 20, 2017.
All submissions will be reviewed by the IBIS Board and are subject to
approval before Presentation at the Summit.
Note, vendor-specific, confidential or product promotion material is
forbidden at IBIS summits. Presentations MUST be submitted by the
deadline for review. The IBIS Open Forum reserves the right to reject
submitted presentations or stop a scheduled presentation containing
content that has not been reviewed.
AGENDA
The agenda includes presentations, discussions, breaks, and a FREE
lunch. A formal list of speakers and topics will be released one
week prior to the event.
TENTATIVE TOPICS
Signal Integrity Software
Chair's Status Report
Mentor Graphics Corporation
IBIS-AMI Task Group Report
Intel Corporation
IBIS Interconnect Task Group Report
Signal Integrity Software
Things You Can Learn from a Pulse Response
IBM Corporation and GLOBALFOUNDARIES
The AMI_Resolve: A Case Study for 56G PAM4
Intel Corporation
Practical HSIO Link Design and Optimization with Repeater and
Retimer
Huawei Technologies and Shenzhen Zhongzeling Electronics
Necessity for Integrating FEC Functionality for PAM4 in AMI
Simulations
IO Methodology
Using Data Files for IBIS-AMI topic
SPISim
AMI Analysis Using a Proxy Class
Mentor Graphics
Technical topic TBD
Teraspeed Labs
Update on IBISCHK6.1.3 and Executable Model File Checking
HOTEL AND TRAVEL INFORMATION
The hotel and travel link below provides hotel information and
transportation suggestions:
http://www.designcon.com/santaclara/registration/travel-and-venue
