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[pcdlist] CAF
- From: louis.guerin@xxxxxxxxxxx (Louis Guerin)
- To: <pcdlist@xxxxxxxxxxxxx>
- Date: Thu, 5 Dec 2002 15:23:05 -0500
Hi,
I'm searching documentations about CAF (Conductive Anodic Filament)
formation. We are designing PCB's with circuitry generating pulses in the
300V to 400V range and having a supply around 450V. I know by IPC related
documentation which spaces I need to keep, but these values, in my opinion,
are like to be for a circuitry on the primary side (i.e. circuitry connected
to the wall plug) which need to withstand spike surge of a few hundreds
volts and remain operational. Our circuit is isolated from the primary side
and do not need this kind of extra security.
In the last PCD Design issue (December 2002), Bernard Voss wrote that the
dielectric strength of PCB's materials are based on a hi-pot test which is
measured on a short term period. Our circuits have to work 24 hours a day,
all year round.
Any info on the subject will be appreciated.
Thanks,
Louis Guérin
PCB Designer
R/D Tech Inc.
505 boul. du Parc-Technologique
Quebec, Qc
G1P 4S9
Tel.: (418) 263-3647
Fax: (418) 263-3742
Email: louis.guerin@xxxxxxxxxxx
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